MEMS devices and methods of fabrication thereof
US9138994B2 · kind B2 · utility
48Cited by
5References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 7, 2010 |
| Grant date | Sep 22, 2015 |
| Priority date | — |
| Expiry date | Jul 26, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/1646
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
MEMS devices and methods of fabrication thereof are described. In one embodiment, the MEMS device includes a bottom alloy layer disposed over a substrate. An inner material layer is disposed on the bottom alloy layer, and a top alloy layer is disposed on the inner material layer, the top and bottom alloy layers including an alloy of at least two metals, wherein the inner material layer includes the alloy and nitrogen. The top alloy layer, the inner material layer, and the bottom alloy layer form a MEMS feature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.