Halogen-free resin composition and method for preparation of copper clad laminate with same
US9139750B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 2, 2011 |
| Grant date | Sep 22, 2015 |
| Priority date | — |
| Expiry date | Sep 2, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1075
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A halogen-free resin composition and a method for preparation of copper clad laminate with the same, wherein based on total parts by weight of solid components, the halogen-free resin composition comprises a reactive allyl phenoxy cyclotriphosphazene or vinyl phenoxy cyclotriphosphazene of 5-50 parts, a thermosetting resin of 15-85 parts, a crosslinking curing agent of 1-35 parts, a crosslinking curing accelerant of 0-5 parts and a filler of 0-100 parts. In the present invention, the reactive allyl phenoxy cyclotriphosphazene or vinyl phenoxy cyclotriphosphazene having very low water absorption is introduced into the thermosetting resin, satisfying both the halogen-free and antiflaming requirements and improving the electrical properties of the system, and making it possible to prepare the halogen-free high-frequency high-speed substrate material. The resulted copper clad laminate satisfies the halogen-free requirement, and has advantages such as excellent resistance to heat and moisture, and low dielectric loss.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.