Structures and methods for testing printable integrated circuits
US9142468B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 24, 2011 |
| Grant date | Sep 22, 2015 |
| Priority date | — |
| Expiry date | Aug 24, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate includes an anchor area (30) physically secured to a surface of the substrate (10) and at least one printable electronic component (20). The at least one printable electronic component includes an active layer (14) having one or more active elements thereon, and is suspended over the surface of the substrate by electrically conductive breakable tethers (40). The electrically conductive breakable tethers include an insulating layer and a conductive layer thereon that physically secure and electrically connect the at least one printable electronic component to the anchor area, and are configured to be preferentially fractured responsive to pressure applied thereto. Related methods of fabrication and testing are also discussed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.