Semiconductor device and manufacturing method thereof
US9142523B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 22, 2013 |
| Grant date | Sep 22, 2015 |
| Priority date | — |
| Expiry date | Jan 15, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a carrier, a die including a first surface and a second surface, a plurality of first conductive bumps disposed between the second surface of the carrier and the die, wherein the die is flip bonded on the carrier, and a molding disposed over the carrier and surrounding the die, wherein the molding includes a recessed portion disposed on the first surface of the die thereby leaving a portion of the first surface is uncovered by the molding. Further, a method of manufacturing a semiconductor device includes providing a carrier, flip bonding a die on the carrier, disposing a rubber material on a first surface of the die and within the first surface of the die, and forming a molding surrounding the rubber material and covering the carrier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.