Method and system for measuring bumps based on phase and amplitude information
US9147102B2 · kind B2 · utility
1Cited by
14References
16Claims
0Family size
Assignee
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Key dates
| Filing date | Jan 2, 2012 |
| Grant date | Sep 29, 2015 |
| Priority date | — |
| Expiry date | Jan 4, 2033 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B21/0056
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method and device for measuring a height of a microscopic structure such as solder bumps. For simplicity of explanation, the invention is described with respect to phase information and amplitude information wherein phase detection and calculation algorithms are being used.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.