Substrate processing pallet with cooling
US9147588B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 9, 2007 |
| Grant date | Sep 29, 2015 |
| Priority date | — |
| Expiry date | Jul 4, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6831
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate processing pallet can cool a substrate. A substrate processing pallet can include a base member; an interface pad attachable to the base member, the interface pad having substantially the same coefficient of thermal expansion as the base member and adapted to facilitate cooling of the substrate; and a surface of the base member having features for aligning a substrate on the interface pad. A substrate processing pallet can also include a base member; an interface pad attachable to the base member; an electrostatic chuck for gripping the substrate during processing; an energy storage system for storing energy to sustain the electrostatic chuck at sufficient charge to sustain grip the substrate during processing; and a conduit for transporting gas to a backside of the substrate to facilitate cooling of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.