Semiconductor power device having a heat sink

US9147631B2 · kind B2 · utility

Assignee

• Infineon Technologies Austria AG · AT

Inventors

• Ralf Otremba · Kaufbeuren, DE
• Josef Hoeglauer · Munich, DE
• Juergen Schredl · Mering, DE
• Xaver Schloegel · Sachsenkam, DE
• Klaus Schiess · Allensbach, DE

Key dates

• Filing date: Apr 17, 2013
• Grant date: Sep 29, 2015
• Expiry date: May 23, 2033

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/181
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A semiconductor device includes an electrically conducting carrier having a mounting surface. The semiconductor device further includes a metal block having a first surface facing the electrically conducting carrier and a second surface facing away from the electrically conducting carrier. A semiconductor power chip is disposed over the second surface of the metal block.