Inventor · Allensbach, DE

Klaus Schiess

76Patents
8h-index
71Co-inventors
77Inventor score

Filing activity: Mar 16, 2006 → Feb 15, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US7569920B2 Electronic component having at least one vertical semiconductor power transistor Electricity 26 Active
US7479691B2 Power semiconductor module having surface-mountable flat external contacts and method for producing the same Electricity 22 Active
US7799614B2 Method of fabricating a power electronic device Electricity 20 Active
US7759777B2 Semiconductor module Electricity 17 Active
US8030131B2 Semiconductor module Electricity 16 Active
US7701054B2 Power semiconductor module and method for its manufacture Electricity 12 Active
US8507320B2 Electronic device including a carrier and a semiconductor chip attached to the carrier and manufacturing thereof Electricity 9 Active
US9099454B2 Molded semiconductor package with backside die metallization Electricity 8 Active
US7728415B2 Power semiconductor component stack using lead technology with surface-mountable external contacts and a method for producing the same Electricity 7 Active
US9048838B2 Switching circuit Electricity 6 Active
US7807504B2 Semiconductor module Electricity 6 Active
US7879652B2 Semiconductor module Electricity 5 Active
US8129225B2 Method of manufacturing an integrated circuit module Electricity 5 Active
US9478484B2 Semiconductor packages and methods of formation thereof Electricity 5 Active
US9812373B2 Semiconductor package with top side cooling heat sink thermal pathway Electricity 4 Active
US8952545B2 Electronic device including a carrier and a semiconductor chip attached to the carrier and manufacturing thereof Electricity 3 Active
US9147631B2 Semiconductor power device having a heat sink Electricity 3 Active
US9881862B1 Top side cooling for GaN power device Electricity 3 Active
US9373566B2 High power electronic component with multiple leadframes Electricity 3 Active
US9443787B2 Electronic component and method Electricity 3 Active
US10566260B2 SMD package with top side cooling Electricity 3 Active
US7928553B2 Power electronic device Electricity 3 Active
US11081455B2 Semiconductor device with bond pad extensions formed on molded appendage Electricity 2 Active
US7851927B2 Semiconductor component comprising a semiconductor chip and semiconductor component carrier with external connection strips Electricity 2 Active
US10290566B2 Electronic component Electricity 2 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.