Heat removal in an integrated circuit assembly using a jumping-drops vapor chamber
US9147633B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 4, 2013 |
| Grant date | Sep 29, 2015 |
| Priority date | — |
| Expiry date | Dec 4, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments of the present disclosure are directed towards techniques and configurations for thermal management of an integrated circuit assembly using a jumping-drops vapor chamber. In one embodiment, an apparatus includes a die having a first side including a plurality of integrated circuit devices that are configured to generate heat when in operation, and a second side disposed opposite to the first side, and a vapor chamber including a liquid, an evaporator including a surface that is thermally coupled with the second side of the die, the evaporator being configured to evaporate the liquid to vapor, and a condenser including a superhydrophobic surface and configured to condense the vapor, wherein energy released from coalescence of condensed vapor on the superhydrophobic surface causes the condensed vapor to jump from the superhydrophobic surface of the condenser to the surface of the evaporator. Other embodiments may be described and/or claimed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.