Contact-based encapsulation
US9147635B2 · kind B2 · utility
1Cited by
234References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 13, 2010 |
| Grant date | Sep 29, 2015 |
| Priority date | — |
| Expiry date | Apr 11, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S2301/176
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electrical connection between two chips includes an IC pad on a first chip, an IC pad on a second chip, a first barrier metal over the IC pad of the first chip, a second barrier metal over the IC pad of the second chip, a malleable electrically conductive metal, different from the barrier metals, trapped between the first barrier metal and the second barrier metal, the first barrier metal, the malleable conductive metal and the second barrier metal forming a complete electrically conductive path between the IC pad of the first chip and the IC pad of the second chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.