Patent · US Active

Stacked power supplies for integrated circuit devices and methods of making the same

US9147658B2 · kind B2 · utility

0Cited by
7References
22Claims
0Family size

Assignee

Inventor

Key dates

Filing dateOct 24, 2011
Grant dateSep 29, 2015
Priority date
Expiry dateJul 30, 2034

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/0002
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

Disclosed herein are integrated circuit devices having stacked power supplies and methods of making such integrated circuit devices. In one example, the device includes a first power supply structure, a second power supply structure electrically isolated from the first power supply structure, wherein at least a portion of the second power supply structure is positioned vertically below at least a portion of the first power supply structure, wherein the first power supply structure is one of an interruptible or an uninterruptible power supply structure, while the second power supply structure is the other of the interruptible or the uninterruptible power supply structure, a plurality of constant-power circuits conductively coupled to whichever of the first or second power supply structure that is the uninterruptible power supply and a plurality of interruptible-power circuits conductively coupled to whichever of the first or second power supply structure that is the interruptible power supply.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.