Optoelectronic semiconductor chip, method of fabrication and application in an optoelectronic component

US9147806B2 · kind B2 · utility

Assignee

• OSRAM Opto Semiconductors GmbH · DE

Inventors

• Bernd Böhm · Regensburg, DE
• Gertrud Kräuter · Regensburg, DE
• Andreas Plößl · Regensburg, DE

Key dates

• Filing date: Sep 15, 2011
• Grant date: Sep 29, 2015
• Expiry date: Jul 28, 2032

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02E10/52

Abstract

An optoelectronic semiconductor chip includes an active layer with a first and a second major face, including a semiconductor material which emits or receives radiation when the semiconductor chip is in operation; a patterned layer including three-dimensional patterns for outcoupling or incoupling radiation and arranged on the first major face in a beam path of the radiation, wherein the patterned layer includes an inorganic-organic hybrid material.