Inventor · Regensburg, DE

Bernd Böhm

6Patents
1h-index
17Co-inventors
44Inventor score

Filing activity: May 3, 2010 → Aug 13, 2019

Most-cited inventions

PatentTitleAreaCited byStatus
US9704945B2 Carrier substrate and method for producing semiconductor chips Electricity 5 Active
US10224393B2 Method of producing semiconductor chips that efficiently dissipate heat Electricity 1 Active
US8569079B2 Method for producing an optoelectronic semiconductor component Electricity 0 Active
US9466487B2 Photolithographic methods of producing structures in radiation-emitting semiconductor components Electricity 0 Active
US9147806B2 Optoelectronic semiconductor chip, method of fabrication and application in an optoelectronic component Emerging Cross-Sectional Technologies 0 Active
US12159956B2 Optoelectronic semiconductor chip and method for producing an optoelectronic semiconductor chip Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.