Chemical mechanical polishing composition for polishing silicon wafers and related methods
US9150759B2 · kind B2 · utility
3Cited by
6References
8Claims
0Family size
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Key dates
| Filing date | Sep 27, 2013 |
| Grant date | Oct 6, 2015 |
| Priority date | — |
| Expiry date | Nov 19, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/31051
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A chemical mechanical polishing composition for polishing silicon wafers is provided, containing: water, optionally, an abrasive; a cation according to formula (I); piperazine or a piperazine derivative according to formula (II); and, a quaternary ammonium compound; wherein the chemical mechanical polishing composition exhibits a pH of 9 to 12. Also provided are methods of making and using the chemical mechanical polishing composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.