Method and apparatus for monitoring a polishing surface of a polishing pad used in polishing apparatus
US9156122B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 24, 2012 |
| Grant date | Oct 13, 2015 |
| Priority date | — |
| Expiry date | Jan 7, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B53/08
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method is capable of monitoring the polishing surface of the polishing pad without removing the polishing pad from the polishing table. The method includes: conditioning the polishing surface of the polishing pad by causing a rotating dresser to oscillate on the polishing surface; measuring a height of the polishing surface when the conditioning of the polishing surface is performed; calculating a position of a measuring point of the height on a two-dimensional surface defined on the polishing surface; and repeating the measuring of the height of the polishing surface and the calculating of the position of the measuring point to create height distribution in the polishing surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.