Digital 3D fabrication using multi-layered mold

US9156194B2 · kind B2 · utility

Assignee

• Palo Alto Research Center Incorporated · US

Inventors

• Tse Nga Ng · Palo Alto, US
• JengPing Lu · San Jose, US
• Eugene M. Chow · Fremont, US
• Timothy Stowe · Alameda, US
• Janos Veres · San Jose, US
• Philipp H. Schmaelzle · Los Altos, US

Key dates

• Filing date: Mar 14, 2013
• Grant date: Oct 13, 2015
• Expiry date: Jan 15, 2034

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B29C2033/385
• WIPO field: Other special machines
• WIPO sector: Mechanical engineering

Abstract

A replica 3D structure is fabricated inside a multi-layered mold by patterning each mold layer to define a void/opening that matches a corresponding cross section of the structure's peripheral surface, and filling the patterned opening of each layer with a structural material (i.e., before depositing a subsequent layer of mold material). The mold material (e.g., photoresist or another dissolvable sacrificial material) is blanket deposited (e.g., by slot-die, spray coating) and then patterned using a laser or a printed mask. Each layer of modeling material (e.g., polymer, ceramic or metal, or a combination thereof) is electro-plated or otherwise deposited on the previously formed modeling material layer. High vertical resolution is achieved by utilizing relatively thin mold layers. The mold layer deposition, patterning and modeling material deposition is repeated until the replica 3D structure is entirely formed inside the multi-layered mold, and then the mold is dissolved or otherwise removed.