Micromechanical component and manufacturing method for a micromechanical component
US9156675B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 2, 2014 |
| Grant date | Oct 13, 2015 |
| Priority date | — |
| Expiry date | Jul 2, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81B2207/095
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A micromechanical component includes a substrate having a cavern structured into the same, an at least partially conductive diaphragm, which at least partially spans the cavern, and a counter electrode, which is situated on an outer side of the diaphragm oriented away from the substrate so that a clearance is present between the counter electrode and the at least partially conductive diaphragm, the at least partially conductive diaphragm being spanned onto or over at least one electrically insulating material which at least partially covers the functional top side of the substrate, and at least one pressure access being formed on the cavern so that the at least partially conductive diaphragm is bendable into the clearance when a gaseous medium flows from an outer surroundings of the micromechanical component into the cavern. Also described is a manufacturing method for a micromechanical component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.