Apparatus and method for endpoint detection during electronic sample preparation
US9157935B2 · kind B2 · utility
0Cited by
12References
20Claims
0Family size
Inventor
Key dates
| Filing date | Apr 12, 2013 |
| Grant date | Oct 13, 2015 |
| Priority date | — |
| Expiry date | Apr 12, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T409/303864
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An apparatus for endpoint detection during removal of material from an electronic component includes a mounting plate operable to provide physical and electrical attachment for a device-under-test (DUT), a spindle operable to hold a tip for removing material from the DUT, a signal generator operable to provide an input signal to a first electrode, and a microprocessor connected to use an output signal from a second electrode to terminate the removal of material when an endpoint is reached, the first electrode being one of the tip and the DUT and the second electrode being the opposite one of the tip and the DUT.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.