Patent · US Active

Semiconductor die package and method for making the same

US9159656B2 · kind B2 · utility

0Cited by

0References

9Claims

0Family size

Assignee

FAIRCHILD SEMICONDUCTOR CORPORATION · US

Inventors

Oseob Jeon · Seoul, KR
Yoonhwa Choi · Wolhang-myeon, KR
Boon Huan Gooi · Bukit Mertajam, MY
Maria Cristina Estacio · Davao City, PH
David Chong · Bukit Mertajam, MY
Tan Teik Keng · Bukit Mertajam, MY
Shibaek Nam · Haui-myeon, KR
Rajeev Joshi · Cupertino, US
Chung-Lin Wu · Hsinchu, TW
Venkat Iyer · Cupertino, US
Lay Yeap Lim · Bukit Mertajam, MY
Byoung-ok Lee · Seojong-myeon, KR

Key dates

Filing date	Sep 5, 2013
Grant date	Oct 13, 2015
Priority date	—
Expiry date	Sep 5, 2033

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49121
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Semiconductor die packages are disclosed. An exemplary semiconductor die package includes a premolded substrate. The premolded substrate can have a semiconductor die attached to it, and an encapsulating material may be disposed over the semiconductor die.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.