Semiconductor device including a solder and method of fabricating the same
US9159688B2 · kind B2 · utility
1Cited by
6References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 3, 2014 |
| Grant date | Oct 13, 2015 |
| Priority date | — |
| Expiry date | Feb 3, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3841
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a bonding pad on a semiconductor substrate, a bump on the bonding pad, a solder on the bump, and an anti-wetting layer between the bump and the solder extending along a sidewall of the bump, the anti-wetting layer having a first thickness T1 along the sidewall of the bump closer to the solder and a second thickness T2 along the sidewall of the bump closer to the bonding pad, wherein T2<T1.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.