Method for producing a semiconductor module arrangement
US9159698B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 22, 2014 |
| Grant date | Oct 13, 2015 |
| Priority date | — |
| Expiry date | Jan 22, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for producing a semiconductor module arrangement includes providing a semiconductor module and a printed circuit board. The semiconductor module has a circuit mount populated with a semiconductor chip, an adjustment device in a first relative position with respect to the circuit mount, and a plurality of electrical connections each of which has a free end. Each of the connections is routed through a different passage opening in the adjustment device. The printed circuit board is pushed onto the electrical connections by each of the free ends being inserted into a different contact opening in the printed circuit board. The adjustment device is moved to a second relative position, which is different from the first relative position, with respect to the circuit mount.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.