Die-to-die inductive communication devices and methods
US9160423B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 12, 2013 |
| Grant date | Oct 13, 2015 |
| Priority date | — |
| Expiry date | Jan 5, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04B5/24
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments of inductive communication devices include first and second IC die and an inductive coupling substrate. The first IC die has a first coil. The inductive coupling substrate has a second coil and a first signal communication interface (e.g., a third coil or a contact). The second IC die has a second signal communication interface (e.g., a fourth coil or a contact). The first IC die and the inductive coupling substrate are arranged so that the first and second coils are aligned across a gap between the first IC die and the inductive coupling substrate. A dielectric component is positioned within the gap between the first and second coils to galvanically isolate the first IC die and the inductive coupling substrate. During operation, signals are conveyed between the first and second IC die through inductive coupling between the coils and communication through the signal communication interfaces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.