Device and method for generating a plasma discharge for patterning the surface of a substrate
US9161427B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 17, 2010 |
| Grant date | Oct 13, 2015 |
| Priority date | — |
| Expiry date | Apr 3, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05H1/466
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
Device for generating a plasma discharge near a substrate for patterning the surface of the substrate, comprising a first electrode having a first discharge portion and a second electrode having a second discharge portion, a high voltage source for generating a high voltage difference between the first and the second electrode, and positioning means for positioning the first electrode with respect to the substrate. The device is further provided with an intermediate structure that is, in use, arranged in between the first electrode and the substrate while allowing for positioning the first electrode with respect to the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.