Solder paste and solder joint
US9162324B2 · kind B2 · utility
2Cited by
4References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 10, 2006 |
| Grant date | Oct 20, 2015 |
| Priority date | — |
| Expiry date | Nov 13, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0272
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The invention provides a solder paste which has a solidus temperature of 255° C. or above and is improved in the wettability between Bi and Cu or Ag electrode to attain approximately equivalent wettability to those of Pb-containing high-temperature solders even in low-temperature soldering. The solder paste comprises a metal powder component consisting of Bi or a Bi alloy, a solidus temperature lowering metal for Bi, and a solid-phase metal capable of forming an intermetallic compound with the solidus temperature lowering metal, and a flux component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.