Device for hot embossing of a polymer layer
US9162389B2 · kind B2 · utility
0Cited by
12References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 23, 2014 |
| Grant date | Oct 20, 2015 |
| Priority date | — |
| Expiry date | Apr 23, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/7562
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A device for hot embossing of a magnetic nanoparticle (N)-containing polymer layer. The device includes an embossing die, a pressure application means and a magnetic field generating means. The embossing die and the pressure application means are made from materials that do not respond thermally to a magnetic field.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.