Pre-molded MEMS device package having conductive column coupled to leadframe and cover
US9162872B2 · kind B2 · utility
3Cited by
6References
29Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 12, 2013 |
| Grant date | Oct 20, 2015 |
| Priority date | — |
| Expiry date | Aug 27, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A MEMS lead frame package body encloses a MEMS device enclosed in an internal cavity formed by the mold body and cover. To accommodate a MEMS microphone, an acoustic aperture extends through the mold body. In some embodiments, a conductive column extends through the pre-molded body to allow electrical connection from a partially encapsulated lead frame to the conductive cover. Some embodiments may include a multi-tiered cavity within the mold body for mounting an integrated circuit separated by a gap above the MEMS device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.