Process for manufacturing a membrane microelectromechanical device, and membrane microelectromechanical device
US9162876B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 13, 2012 |
| Grant date | Oct 20, 2015 |
| Priority date | — |
| Expiry date | Nov 7, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/0145
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Disclosed herein is a microelectromechanical device and a process for manufacturing same. One or more embodiments may include forming a semiconductor structural layer separated from a substrate by a dielectric layer, and opening a plurality of trenches through the structural layer exposing a portion of the dielectric layer. A sacrificial portion of the dielectric layer is selectively removed through the plurality of trenches in membrane regions so as to free a corresponding portion of the structural layer to form a membrane. To close the trenches, the wafer is brought to an annealing temperature for a time interval in such a way as to cause migration of the atoms of the membrane so as to reach a minimum energy configuration.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.