High speed memory chip module and electronics system device with a high speed memory chip module
US9164942B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 11, 2012 |
| Grant date | Oct 20, 2015 |
| Priority date | — |
| Expiry date | Jun 27, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02D10/00
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A high speed memory chip module includes a type of memory cell array group and a logic unit. The type memory cell array group includes multiple memory cell array integrated circuits (ICs), and each of the memory cell array ICs has a data bus and at least one memory cell array, and corresponds to first metal-oxide-semiconductor field-effect transistor (MOSFET) gate length corresponding to a first MOSFET process. The logic unit accesses the type of memory cell array group through a first transmission bus, where bus width of the first transmission bus is wider than bus width of the data bus of each of the memory cell array ICs. Corresponding to a second MOSFET process, the logic unit has a second MOSFET gate length which is shorter than the first MOSFET gate length.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.