Substrate processing method and substrate processing unit
US9165799B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 25, 2012 |
| Grant date | Oct 20, 2015 |
| Priority date | — |
| Expiry date | Aug 1, 2032 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB08B3/024
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A substrate processing method includes jetting at least one fluid from a fluid nozzle toward a rotating substrate surface while moving the fluid nozzle from a center toward a periphery of the rotating substrate. The fluid nozzle is moved from the center of the substrate to a predetermined point at a constant initial movement speed. The fluid nozzle is subsequently moved from the predetermined point at a movement speed V(r) which satisfies the following relational expression: V(r)×rα=C (constant), where V(r) represents the movement speed of the fluid nozzle when it passes a position corresponding to a position on the substrate surface at a distance “r” from the center of the substrate, and α represents a power index.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.