Method for singulating a component composite assembly

US9165816B2 · kind B2 · utility

Assignee

• OSRAM Opto Semiconductors GmbH · DE

Inventors

• Heribert Zull · Regensburg, DE
• Korbinian Perzlmaier · Regensburg, DE
• Andreas Ploessl · Regensburg, DE
• Thomas Nicolas Emmanuel Veit · Leipzig, DE
• Mathias Kaempf · Burglengenfeld, DE
• Jens Dennemarck · Regensburg, DE
• Bernd Boehm · Obertraubling, DE

Key dates

• Filing date: Mar 16, 2012
• Grant date: Oct 20, 2015
• Expiry date: May 14, 2032

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/018
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A method relates to separating a component composite into a plurality of component regions, wherein the component composite is provided having a semiconductor layer sequence comprising a region for generating or for receiving electromagnetic radiation. The component composite is mounted on a rigid subcarrier. The component composite is separated into the plurality of component regions, wherein one semiconductor body is produced from the semiconductor layer sequence for each component region. The component regions are removed from the subcarrier.