Semiconductor package having etched foil capacitor integrated into leadframe
US9165873B1 · kind B1 · utility
4Cited by
4References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 24, 2014 |
| Grant date | Oct 20, 2015 |
| Priority date | — |
| Expiry date | Sep 24, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19041
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A packaged semiconductor device including a leadframe made of a first metal, the leadframe including structures with surfaces and sidewalls; capacitors attached to surface portions of the leadframe structures, the capacitors having sidewalls coplanar with structure sidewalls; the capacitors including a foil of conductive material attached to the structure surface, the conductive material having pores covered by oxide and filled with conductive polymer, the capacitors topped by electrodes made of a second metal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.