Back side illuminated image sensor having isolated bonding pads
US9165970B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 16, 2011 |
| Grant date | Oct 20, 2015 |
| Priority date | — |
| Expiry date | May 23, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/8057
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided is an image sensor device. The image sensor device includes having a front side, a back side, and a sidewall connecting the front and back sides. The image sensor device includes a plurality of radiation-sensing regions disposed in the substrate. Each of the radiation-sensing regions is operable to sense radiation projected toward the radiation-sensing region through the back side. The image sensor device includes an interconnect structure that is coupled to the front side of the substrate. The interconnect structure includes a plurality of interconnect layers and extends beyond the sidewall of the substrate. The image sensor device includes a bonding pad that is spaced apart from the sidewall of the substrate. The bonding pad is electrically coupled to one of the interconnect layers of the interconnect structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.