Inventor · Guoxing Township, TW

Wen-De Wang

83Patents
9h-index
38Co-inventors
74Inventor score

Filing activity: Oct 15, 2004 → Jul 28, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US7078779B2 Enhanced color image sensor device and method of making the same Electricity 46 Expired
US9142586B2 Pad design for backside illuminated image sensor Electricity 37 Active
US8435824B2 Backside illumination sensor having a bonding pad structure and method of making the same Electricity 17 Active
US7935994B2 Light shield for CMOS imager Electricity 15 Expired
US8461021B2 Multiple seal ring structure Electricity 13 Active
US8604405B2 Backside illuminated image sensor device with refractive index dependent layer thicknesses and method of forming the same Electricity 12 Active
US8531565B2 Front side implanted guard ring structure for backside illuminated image sensor Electricity 11 Active
US8405182B2 Back side illuminated image sensor with improved stress immunity Electricity 10 Active
US8709854B2 Backside structure and methods for BSI image sensors Emerging Cross-Sectional Technologies 9 Active
US8338917B2 Multiple seal ring structure Electricity 8 Active
US9035445B2 Seal ring structure with a metal pad Electricity 8 Active
US7968424B2 Method of implantation Electricity 7 Active
US9123615B2 Vertically integrated image sensor chips and methods for forming the same Electricity 7 Active
US8164124B2 Photodiode with multi-epi films for image sensor Electricity 7 Active
US9165970B2 Back side illuminated image sensor having isolated bonding pads Electricity 6 Active
US9013022B2 Pad structure including glue layer and non-low-k dielectric layer in BSI image sensor chips Electricity 6 Active
US9806119B2 3DIC seal ring structure and methods of forming same Electricity 6 Active
US8981510B2 Ridge structure for back side illuminated image sensor Electricity 6 Active
US8227288B2 Image sensor and method of fabricating same Electricity 5 Active
US8969991B2 Backside structure and methods for BSI image sensors Emerging Cross-Sectional Technologies 5 Active
US8283754B2 Seal ring structure with metal pad Electricity 5 Active
US9455288B2 Image sensor structure to reduce cross-talk and improve quantum efficiency Electricity 4 Active
US8383440B2 Light shield for CMOS imager Electricity 4 Active
US8569807B2 Backside illuminated image sensor having capacitor on pixel region Electricity 4 Active
US8502389B2 CMOS image sensor and method for forming the same Electricity 4 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.