Integrated circuit packaging system with embedded component and method of manufacture thereof
US9171795B2 · kind B2 · utility
1Cited by
4References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 1, 2014 |
| Grant date | Oct 27, 2015 |
| Priority date | — |
| Expiry date | Dec 1, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/221
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit packaging system, and a method of manufacture of an integrated circuit packaging system thereof, including: an embedding material on a component; a mask layer on the embedding material; a buried pattern in the mask layer, the outer surface of the buried pattern coplanar with the outer surface of the mask layer, the buried pattern electrically connected to the component; a patterned dielectric on a portion of the buried pattern; and an integrated circuit die on the buried pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.