Method of making a semiconductor chip including identifying marks
US9171806B2 · kind B2 · utility
8Cited by
12References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 9, 2014 |
| Grant date | Oct 27, 2015 |
| Priority date | — |
| Expiry date | Jun 9, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor chip includes a first mark for identifying a position of the chip within an exposure field. The semiconductor chip includes a first matrix in a first layer of the chip and a second mark within the first matrix identifying a position of the exposure field on a wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.