Inspection assembly
US9176070B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 7, 2014 |
| Grant date | Nov 3, 2015 |
| Priority date | — |
| Expiry date | Apr 11, 2034 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2201/12
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for inspecting wafers or other flat objects having an object surface, comprises the steps of: providing a camera assembly with a camera for recording images of said object surface or portions of said object surface during an exposure time which is limited by a shutter; generating a continuous relative movement of said camera assembly and said object without interruption, whereby a movement blur of said image during said exposure time is caused; continuously illuminating said object with an illuminance which is controlled to remain at the same value; and recording one or more images of at least one of said portions of said object surface with said camera; defining a movement blur which is acceptable for an analysis of said image wherein said exposure time is smaller than a time causing said acceptable movement blur; and performing said analysis of said image.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.