Systems and methods of advanced site-based nanotopography for wafer surface metrology
US9177370B2 · kind B2 · utility
5Cited by
3References
52Claims
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Key dates
| Filing date | Feb 28, 2013 |
| Grant date | Nov 3, 2015 |
| Priority date | — |
| Expiry date | Sep 7, 2033 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30148
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Systems and methods for providing micro defect inspection capabilities for optical systems are disclosed. Each given wafer image is filtered, treated and normalized prior to performing surface feature detection and quantification. A partitioning scheme is utilized to partition the wafer image into a plurality of measurement sites and metric values are calculated for each of the plurality of measurement sites. Furthermore, transformation steps may also be utilized to extract additional process relevant metric values for analysis purposes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.