Shielded sockets for microprocessors and fabrication thereof by overmolding and plating
US9178328B2 · kind B2 · utility
3Cited by
7References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 28, 2013 |
| Grant date | Nov 3, 2015 |
| Priority date | — |
| Expiry date | Sep 5, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/10
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Shielded sockets for microprocessors and fabrication of shielded sockets by overmolding and plating techniques are described. In an example, a socket for a packaged semiconductor device includes a plastic housing having walls surrounding a cavity. A plurality of contact strips is disposed in the cavity and supported by one or more of the walls of the plastic housing. Each of the plurality of contact strips includes a plurality of contacts. Each of the plurality of contacts includes a vertical region overmolded with plastic, a contact portion, and a J-lead portion. The plastic is coated with a metal layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.