MEMS devices and methods of forming the same
US9181083B2 · kind B2 · utility
50Cited by
0References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 12, 2014 |
| Grant date | Nov 10, 2015 |
| Priority date | — |
| Expiry date | Sep 12, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D1/692
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A device includes a substrate, a routing conductive line over the substrate, a dielectric layer over the routing conductive line, and an etch stop layer over the dielectric layer. A Micro-Electro-Mechanical System (MEMS) device has a portion over the etch stop layer. A contact plug penetrates through the etch stop layer and the dielectric layer. The contact plug connects the portion of the MEMS device to the routing conductive line. An escort ring is disposed over the etch stop layer and under the MEMS device, wherein the escort ring encircles the contact plug.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.