Solution and process for activating the surface of a semiconductor substrate
US9181623B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 9, 2010 |
| Grant date | Nov 10, 2015 |
| Priority date | — |
| Expiry date | Nov 29, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76898
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A solution and a process are used for activating the surface of a substrate comprising at least one area formed from a polymer, for the purpose of subsequently covering it with a metallic layer deposited via an electroless process. The composition contains: A) an activator formed from one or more palladium complexes; B) a binder formed from one or more organic compounds chosen from compounds comprising at least two glycidyl functions and at least two isocyanate functions; and C) a solvent system formed from one or more solvents capable of dissolving said activator and said binder. The solution and process may be applied for the manufacture of electronic devices such as integrated circuits, especially in three dimensions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.