Semiconductor wafer inspection system and method
US9182357B2 · kind B2 · utility
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1References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 23, 2010 |
| Grant date | Nov 10, 2015 |
| Priority date | — |
| Expiry date | Mar 10, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A wafer inspection system comprises a camera having a field of view, an object mount configured to position at least a portion of surface 5 of an object 3 at an object plane 15 relative to the camera and within the field of view of the camera and at least one surface portion 41 carrying a multitude of retroreflectors 95 disposed at a greater Δd distance from the camera than the object plane and within the field of view of the camera.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.