Cooling apparatus for an integrated circuit
US9184112B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 17, 2014 |
| Grant date | Nov 10, 2015 |
| Priority date | — |
| Expiry date | Dec 17, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3512
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A chip fabricated from a semiconductor material is disclosed. The chip may include active devices located below a first depth from a chip back side and a structure configured to remove heat from the chip. The structure may include microvias electrically insulated from the active devices and having a second depth, less than the first depth, from the back side towards the active devices. Each microvia may also have a fill material having a thermal conductivity greater than a semiconductor thermal conductivity. The structure may also include thermally conductive material regions on the back side of the chip in contact with sets of microvias. The structure may also include through-silicon vias electrically connected to the active devices, and extending from the back side to an active device side of the chip and configured to remove heat from the active devices to the back side of the chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.