Sudeep Mandal
32Patents
5h-index
36Co-inventors
65Inventor score
Filing activity: Jun 23, 2008 → Oct 26, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9008278B2 | Multilayer X-ray source target with high thermal conductivity | Electricity | 34 | Active |
| US9184112B1 | Cooling apparatus for an integrated circuit | Electricity | 7 | Active |
| US8552363B2 | System and method for optically driven separations using fluid filled core optical fibers | Physics | 7 | Active |
| US10049570B2 | Controlling right-of-way for priority vehicles | Physics | 6 | Active |
| US10120102B2 | Fluid sensor cable assembly, system, and method | Physics | 5 | Active |
| US10393532B2 | Emergency responsive navigation | Physics | 4 | Active |
| US9536732B2 | Low temperature fabrication of lateral thin film varistor | Electricity | 3 | Active |
| US9356089B1 | Low temperature fabrication of lateral thin film varistor | Electricity | 3 | Active |
| US9871020B1 | Through silicon via sharing in a 3D integrated circuit | Electricity | 2 | Active |
| US10634890B1 | Miniaturized microscope for phase contrast and multicolor fluorescence imaging | Physics | 2 | Active |
| US10043962B2 | Thermoelectric cooling using through-silicon vias | Electricity | 1 | Active |
| US9913405B2 | Glass interposer with embedded thermoelectric devices | Electricity | 1 | Active |
| US9559283B2 | Integrated circuit cooling using embedded peltier micro-vias in substrate | Electricity | 1 | Active |
| US9472483B2 | Integrated circuit cooling apparatus | Electricity | 1 | Active |
| US10208587B1 | System and method for monitoring integrity of a wellbore | Physics | 1 | Active |
| US10249590B2 | Stacked dies using one or more interposers | Electricity | 1 | Active |
| US9068927B2 | Laboratory diffraction-based phase contrast imaging technique | Electricity | 1 | Active |
| US9410892B2 | Nanoscale optofluidic devices for molecular detection | Physics | 0 | Active |
| US10400574B2 | Apparatus and method for inspecting integrity of a multi-barrier wellbore | Physics | 0 | Active |
| US10013519B2 | Performance matching in three-dimensional (3D) integrated circuit (IC) using back-bias compensation | Physics | 0 | Active |
| US10170224B2 | Low temperature fabrication of lateral thin film varistor | Electricity | 0 | Active |
| US9496234B1 | Wafer-level chip-scale package structure utilizing conductive polymer | Electricity | 0 | Active |
| US9870851B2 | Low temperature fabrication of lateral thin film varistor | Electricity | 0 | Active |
| US11782181B2 | Data fusion enhanced multi-modality wellbore integrity inspection system | Physics | 0 | Active |
| US9892999B2 | Producing wafer level packaging using leadframe strip and related device | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.