Integrated circuit packaging system with interposer and method of manufacture thereof
US9184122B2 · kind B2 · utility
2Cited by
2References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 6, 2012 |
| Grant date | Nov 10, 2015 |
| Priority date | — |
| Expiry date | Nov 7, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48227
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacture of an integrated circuit packaging system includes: providing an interposer having an interposer bottom side and an interposer top side; attaching a base integrated circuit to the interposer bottom side; attaching a lead to the interposer bottom side, the lead adjacent the base integrated circuit and entirely below the interposer; and forming an encapsulation partially covering the lead and exposing the interposer top side.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.