Method of producing printed circuit board, and printed board produced by the method
US9185811B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 2, 2011 |
| Grant date | Nov 10, 2015 |
| Priority date | — |
| Expiry date | Aug 12, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1572
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of producing a printed circuit board includes: forming a metal layer on a support plate; forming a mask layer on the metal layer; forming a pattern plating having a stem as plating up to a level of the mask layer, and a cap as a portion of plating exceeding the mask layer and having an outgrowth lying over the surface of the mask layer; laminating an insulating base on a conductive circuit board constituted by the support plate, the metal layer and the pattern plating to form a circuit board intermediate in which the pattern plating is buried in the base; removing the support plate and the metal layer to form an exposed surface; and mechanically polishing the exposed surface until the stem of the pattern plating is removed, to increase the width of the conductive pattern on the exposed surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.