Apparatus for manufacturing semiconductor device, method of manufacturing semiconductor device, and recording medium
US9190299B2 · kind B2 · utility
5Cited by
1References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 21, 2014 |
| Grant date | Nov 17, 2015 |
| Priority date | — |
| Expiry date | May 21, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67109
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for manufacturing semiconductor devices is provided with a processing liquid supply part for supplying processing liquid into a processing chamber which houses a substrate, a heater part for heating the processing liquid in the processing chamber, and a substrate support part which is provided in the processing chamber and supports the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.