Patent · US Active

Semiconductor device with webbing between leads

US9190351B2 · kind B2 · utility

5Cited by

15References

18Claims

0Family size

Assignee

FREESCALE SEMICONDUCTOR, INC. AUSTIN · US

Inventors

Zhigang Bai · Milpitas, US
Hui Teng Wang · Muar, MY
Jinzhong Yao · Tianjin, CN

Key dates

Filing date	Oct 20, 2014
Grant date	Nov 17, 2015
Priority date	—
Expiry date	Oct 20, 2034

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/0002
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A quad flat package integrated circuit (IC) device has alternating inner and outer leads that protrude from a package body. The inner leads are j-shaped leads and the outer leads are gull-wing shaped leads. The package body is formed such that it includes plastic lead webbings between adjacent leads, which help prevent metal particles from getting lodged between the leads and causing electrical shorts. The webbings are made of the same molding compound as the package body and are formed together with the package body.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.