Hui Teng Wang
7Patents
2h-index
11Co-inventors
44Inventor score
Filing activity: Jun 6, 2003 → Jul 24, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6897561B2 | Semiconductor power device having a diamond shaped metal interconnect scheme | Electricity | 16 | Expired |
| US9190351B2 | Semiconductor device with webbing between leads | Electricity | 5 | Active |
| US8916958B2 | Semiconductor package with multiple chips and substrate in metal cap | Electricity | 2 | Active |
| US9111772B1 | Electronic array and chip package | Electricity | 2 | Active |
| US10861828B2 | Molded semiconductor package having a package-in-package structure and methods of manufacturing thereof | Electricity | 0 | Active |
| US10418343B2 | Package-in-package structure for semiconductor devices and methods of manufacture | Electricity | 0 | Active |
| US8207037B2 | Method for manufacturing a semiconductor component that includes a field plate | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.