Single side polishing using shape matching
US9193025B2 · kind B2 · utility
0Cited by
4References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 13, 2013 |
| Grant date | Nov 24, 2015 |
| Priority date | — |
| Expiry date | Jan 21, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/03
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of polishing a wafer is disclosed that includes determining a removal profile. The wafer is measured to determine a starting wafer profile and then the wafer is polished. The wafer is again measured after being polished to determine a polished wafer profile. The starting wafer profile and the polished wafer profile are compared to each other to determine the removal profile by computing the amount and shape of material removed from the first wafer during polishing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.