John A. Pitney
22Patents
6h-index
16Co-inventors
62Inventor score
Filing activity: Dec 27, 2007 → Jun 11, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8330245B2 | Semiconductor wafers with reduced roll-off and bonded and unbonded SOI structures produced from same | Electricity | 18 | Active |
| US9117670B2 | Inject insert liner assemblies for chemical vapor deposition systems and methods of using same | Electricity | 13 | Active |
| US8165706B2 | Methods for generating representations of flatness defects on wafers | Electricity | 13 | Active |
| US7878562B2 | Semiconductor wafer carrier blade | Emerging Cross-Sectional Technologies | 11 | Active |
| US8186661B2 | Wafer holder for supporting a semiconductor wafer during a thermal treatment process | Emerging Cross-Sectional Technologies | 10 | Active |
| US8404049B2 | Epitaxial barrel susceptor having improved thickness uniformity | Chemistry; Metallurgy | 8 | Active |
| US9583364B2 | Processes and apparatus for preparing heterostructures with reduced strain by radial compression | Electricity | 6 | Active |
| US8440541B2 | Methods for reducing the width of the unbonded region in SOI structures | Electricity | 6 | Active |
| US10361097B2 | Apparatus for stressing semiconductor substrates | Electricity | 5 | Active |
| US9401271B2 | Susceptor assemblies for supporting wafers in a reactor apparatus | Electricity | 5 | Active |
| US9583363B2 | Processes and apparatus for preparing heterostructures with reduced strain by radial distension | Electricity | 5 | Active |
| US8340801B2 | Systems for generating representations of flatness defects on wafers | Electricity | 4 | Active |
| US10145011B2 | Substrate processing systems having multiple gas flow controllers | Electricity | 3 | Active |
| US8940094B2 | Methods for fabricating a semiconductor wafer processing device | Emerging Cross-Sectional Technologies | 3 | Active |
| US11282715B2 | Apparatus for stressing semiconductor substrates | Electricity | 1 | Active |
| US9328420B2 | Gas distribution plate for chemical vapor deposition systems and methods of using same | Electricity | 1 | Active |
| US11276583B2 | Apparatus for stressing semiconductor substrates | Electricity | 1 | Active |
| US8080464B2 | Methods for processing silicon on insulator wafers | Electricity | 0 | Active |
| US10184193B2 | Epitaxy reactor and susceptor system for improved epitaxial wafer flatness | Electricity | 0 | Active |
| US9193025B2 | Single side polishing using shape matching | Performing Operations; Transporting | 0 | Active |
| US11276582B2 | Apparatus for stressing semiconductor substrates | Electricity | 0 | Active |
| US11764071B2 | Apparatus for stressing semiconductor substrates | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.